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Silicon Wafer Cutting Tools, Diamond scribing Glass Portable Slicing and Dicing Machine(Diamond Cutter Head)
4.0 (132 items)
Limited Time SaleUntil the end
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US$391.15 cheaper than the new price!!
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Used US$260.77
Product details
| Management number | 220715227 | Release Date | 2026/05/03 | List Price | US$260.77 | Model Number | 220715227 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
==========Chemicals of very high concern: NoneType: Hand Tool Parts
- Suitable for silicon wafer cutting: specially designed for silicon wafers, with precise cutting to meet processing requirements, suitable for laboratories.
- Diamond cutting aids: High hardness diamond parts ensure precision and extend service life.
- Portable design: easy to carry, suitable for laboratory movement, enhancing flexibility and convenience.
- Glass slicing function: With glass slicing function, it expands the scope and meets diversified processing.
- Specially designed to assist experimental cutting, convenient and practical.
| Item Weight | 1.76 ounces |
|---|---|
| Manufacturer | vamarads |
| Item model number | vamarads |
| Product Dimensions | 3.94 x 3.94 x 3.94 inches |
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